Gold Plating SMD Ceramic Hybrid Integrated Circuit Package

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JOPTEC LASER CO., LTD

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Gold Plating SMD Ceramic Hybrid Integrated Circuit Package

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Gold Plating SMD Ceramic Hybrid Integrated Circuit Package

Technical characteristics: Micro channel heat sink Flatness of chip mounting area ≤ 2 um Roughness of chip mounting area ≤ 0.3 um Plating thickness: Ni (2-5um) Au (0.05-0.15um) Water flow ≥ 300ml/min ...

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SMD Hybrid Integrated Circuit Package

Gold Plating Ceramic Integrated Package

JOPTEC Integrated Circuit Package

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